L. Reif

发表

Wafer Level 3-D ICs Process Technology

R. Gutmann, C. S. Tan, L. Reif, 2008 .

Cu Wafer Bonding for 3D IC Applications

Kuan-Neng Chen, A. Fan, C. S. Tan, 2008 .

A new data effort to inform career choices in biomedicine

Freeman A. Hrabowski, M. Pollack, R. Blank, 2017, Science.

Plasma Etching of Silicon Dioxide and Silicon Nitride with Non-Perfluorocompound Chemistries: Trifluoroacetic Anhydride and Iodofluorocarbons

L. Reif, S. Karecki, L. Pruette, 1996 .

Quantitative correlations between the performance of polysilicon emitter transistors and the evolution of polysilicon/silicon interfacial oxides upon annealing

L. Reif, S. Ajuria, C. H. Gan, 1992 .

Quantitative Correlations Between the Performance of Poly silicon Emitter Transistors and the Evolution of Poly silicon/ S ilicon Interfacial Oxides

L. Reif, S. Ajuria, C. H. Gan, 1992 .

Gas Source Molecular Beam Epitaxy of Compound Semiconductors

Shanhui Fan, Hermann A. Haus, Joseph P. Donnelly, 1995 .

Si/Si/sub 1-x/Ge/sub x/ valence band discontinuity measurements using a semiconductor-insulator-semiconductor (SIS) heterostructure

C. Sodini, E. Crabbé, B. Meyerson, 1994 .

Si/Sil-,Ge, Valence Band Discontinuity Insulator-Semiconductor (SIS) Heterostructure Using Measurements a Semiconductor-

C. Sodini, B. Meyerson, B. R. Bennett, 1994 .