L. Camilletti

The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes

D. Boning, J. Chung, B. Stine, 1998 .

A MATHEMATICAL MODEL OF PATTERN DEPENDENCIES IN Cu CMP PROCESSES

D. Boning, L. Camilletti, T. Park, 1999 .

Modeling of chemical-mechanical polishing: a review

G. Nanz, L. E. Camilletti, L. Camilletti, 1995 .

Comparison between HDP CVD and PECVD silicon nitride for advanced interconnect applications

M. Liang, W. Chang, S. Jang, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).