Brian Lee

发表

MODELING OF PATTERN DEPENDENCIES IN ABRASIVE-FREE COPPER CHEMICAL MECHANICAL POLISHING PROCESSES

D. Boning, T. Park, T. Tugbawa, 2001 .

MODELING OF PATTERN DEPENDENCIES FOR MULTI-LEVEL COPPER CHEMICAL-MECHANICAL POLISHING PROCESSES

Duane S. Boning, Brian Lee, Tamba Tugbawa, 2001 .

USING SMART DUMMY FILL AND SELECTIVE REVERSE ETCHBACK FOR PATTERN DENSITY EQUALIZATION

Duane S. Boning, Brian Lee, David J. Stein, 2000 .

Pattern Dependent Modeling for CMP Optimization and Control

D. Boning, T. Park, T. Tugbawa, 1999 .

Modeling of chemical mechanical polishing for shallow trench isolation

Brian Lee, Brian Lee, 2002 .

RE-EXAMINING THE PHYSICAL BASIS OF PATTERN DENSITY AND STEP HEIGHT CMP MODELS

D. Boning, T. Park, T. Tugbawa, 2003 .

A Fixed Abrasive CMP Model

D. Boning, Brian Lee, L. Economikos, 2001 .