S. Fukada

Trench and via filling profile simulations for copper electroplating process

H. Akahoshi, T. Itabashi, Kinya Kobayashi, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Electromigration Resistance Measurements of Multilayered Interconnections by Short Test Lines

S. Fukada, Masayoshi Hirasawa, Masayuki Suzuki, 1995 .

1H NMR and Differential Scanning Calorimetry Studies on Molecular Motions and Phase Transitions in Butylammonium Bromide

S. Fukada, R. Ikeda, D. Nakamura, 1984 .

1H NMR and Differential Scanning Calorimetry Studies of Molecular Motion and Phase Transition in Butylammonium Iodide

S. Fukada, R. Ikeda, D. Nakamura, 1985 .

Studies of the anisotropic self-diffusion and reorientation of butylammonium cations in the rotator phase of butylammonium chloride using 1H magnetic resonance, electrical conductivity and thermal measurements

S. Fukada, M. Hattori, R. Ikeda, 1990 .

0.5-/spl mu/m-pitch copper-dual-damascene metallization using organic SOG (k=2.9) for 0.18-/spl mu/m CMOS applications

T. Ohshima, K. Hinode, S. Fukada, 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).

Structural Phase Transition in Orthorhombic and Monoclinic Fe3+ Doped K3Co(CN)6 Crystals as Studied by the Temperature Variation of 14N NQR Frequencies

S. Fukada, T. Asaji, D. Nakamura, 1986 .

Electromigration Resistance Measurements of Multilayered Interconnections by Short Test Lines

S. Fukada, Masayuki Suzuki, M. Hirasawa, 1995 .

Influence of silicon concentration and layering of molybdenum silicide on the reliability of Al–Si–Cu interconnections

J. Onuki, S. Fukada, M. Suwa, 1991 .

Interaction between Al–Si–Cu alloys and MoSi2

J. Onuki, S. Fukada, M. Suwa, 1991 .

Stress migration resistance of Al-Si-Pd alloy interconnects

Shinichi Fukada, J. Onuki, S. Fukada, 1989, Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference.