C. Kaanta

Dual Damascene: a ULSI wiring technology

J. G. Ryan, C. Kaanta, S. Bombardier, 1991, 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference.

Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing

Charles W. Koburger, Peter A. Burke, William J. Cote, 1992 .

Submicron wiring technology with tungsten and planarization

P.-I. Lee, C. Kaanta, W. Cote, 1988, 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference.

Submicron wiring technology with tungsten and planarization

K. Holland, Pei-Ing Lee, C. Kaanta, 1988, 1987 International Electron Devices Meeting.