U. Kloter

Interlayer cooling potential in vertically integrated packages

H. Rothuizen, H. Reichl, T. Brunschwiler, 2008 .

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]

H. Rothuizen, T. Brunschwiler, B. Michel, 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa

John R. Thome, Bruno Agostini, Bruno Michel, 2008 .

High heat flux flow boiling in silicon multi-microchannels – Part III: Saturated critical heat flux of R236fa and two-phase pressure drops

John R. Thome, Bruno Agostini, Rémi Revellin, 2008 .

Forced convective interlayer cooling in vertically integrated packages

H. Reichl, B. Wunderle, B. Michel, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance

B. Michel, T. Brunschwiler, H. Rothuizen, 2007, IEEE Transactions on Components and Packaging Technologies.

Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces

B. Michel, T. Brunschwiler, T. Brunschwiler, 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Radially Oscillating Flow Hybrid Cooling System for Low Profile Electronics Applications

H. Rothuizen, T. Brunschwiler, B. Michel, 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

B. Michel, G. Natarajan, T. Brunschwiler, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..