Dewen Tian

Prediction of Micro Pitch Motion of a Microsensor Component during Laser Soldering Interconnection Process

Chunqing Wang, Yanhong Tian, Hongtao Chen, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

N. Lee, J. Lau, C. Ko, 2017 .

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

N. Lee, J. Lau, C. Ko, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Numerical simulation of solder spreading and solidification during solder jet bumping process

Chunqing Wang, Yanhong Tian, Dewen Tian, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Comprehensive modeling and analysis of copper wire bonding process

Dewen Tian, Ming Li, Janardhanan Pillai Madkumar, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface

Chunqing Wang, Yanhong Tian, C. Hang, 2009 .