S. Irving

发表

Power cycling simulation of an IC package: considering electromigration and thermal-mechanical failure

Yong Liu, S. Irving, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

Y. Liu, S. Irving, T. Luk, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Solder Joint Reliability under Electromigration and Thermal-Mechanical Load

Yong Liu, S. Irving, Timwah Luk, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Parameter optimization for wafer probe using simulation

Yong Liu, S. Irving, T. Luk, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Wafer Probing Simulation for Copper Bond Pad Based BPOA Structure

Yong Liu, S. Irving, T. Luk, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Delamination modeling for IC package with multiple initial cracks

Y. Liu, M. Rioux, S. Irving, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Wafer deposition/metallization and back grind, process-induced warpage simulation

S. Irving, You-Rong Liu, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Reliability study of ceramic substrate in a SIP type package

Y. Liu, J. Yang, S. Irving, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Thermal stress simulation in the metal-insulator-metal (MIM) wafer fabrication process

Y. Liu, S. Irving, T. Luk, 2008, 2008 58th Electronic Components and Technology Conference.

A new prediction methodology for electromigration-induced solder degradation in a WL-CSP system

Y. Liu, L. Liang, Xuefan Chen, 2009, 2009 59th Electronic Components and Technology Conference.

Electromigration Time to Failure Simulation for Solder Bumps of a Chip Scale Package

Y. Liu, L. Liang, Yuanxiang Zhang, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Die attach delamination characterization modeling for SOIC package

Yong Liu, M. Rioux, A. Schoenberg, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system

Y. Liu, L. Liang, Yuanxiang Zhang, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

3D Modeling of Electromigration Combined with Thermal-Mechanical Effect for IC Device and Package

Yong Liu, Scott Irving, Timwah Luk, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Assembly process induced stress analysis for new FLMP package by 3D FEA

Yong Liu, S. Irving, Y. Liu, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters

Y. Liu, Wang Qiang, S. Irving, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP

Y. Liu, L. Liang, Yuanxiang Zhang, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package

Yong Liu, S. Irving, D. Desbiens, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Trends of Power Electronic Packaging and Modeling

Yong Liu, S. Irving, T. Luk, 2008, 2008 10th Electronics Packaging Technology Conference.

Thermosonic wire bonding process simulation and bond pad over active stress analysis

Yong Liu, S. Irving, T. Luk, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Impact of Solder Overflow and ACLV Moisture Absorption of Mold Compound on Package Reliability

Yong Liu, S. Irving, T. Luk, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.