Y. Ai

Image classification and analysis during the additive manufacturing process based on deep convolutional neural networks

Sheng Liu, Feng Han, Jingling Zou, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Lead sulfide quantum dot assembly with biocompatible mechanical property and tunable hydrophilicity

Xiaowei Liu, Y. Ai, Sheng Liu, 2022, Materials Science in Semiconductor Processing.

NiOx Nanocrystals with Tunable Size and Energy Levels for Efficient and UV Stable Perovskite Solar Cells

Qiang Tang, Guanqi Tang, Y. Ai, 2022, Advanced Functional Materials.

Research on high-temperature mechanical properties and microstructure of powder metallurgical rhenium

Y. Ai, Sheng Liu, Kun Ma, 2022, International Journal of Refractory Metals and Hard Materials.