Sheng Liu

发表

Sheng Liu, Feng Han, Jingling Zou, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

J. Chu, Xiang Lei, Huai Zheng, 2016, IEEE Transactions on Electron Devices.

Huai Zheng, Zhili Zhao, Zefeng Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Yuanjin Zheng, X. W. Sun, Xiaoli Zhang, 2017, ACS applied materials & interfaces.

Huai Zheng, Guoliang Li, Sheng Liu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Huai Zheng, Sheng Liu, Shangru Zhou, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Yueyun Weng, F. Liu, Sheng Liu, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Huai Zheng, Sheng Liu, Shangru Zhou, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Xiang Lei, Huai Zheng, Sheng Liu, 2017, IEEE Transactions on Power Electronics.

Xiaohong Ding, Ling Xu, Sheng Liu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Sheng Liu, Can Sheng, Rui Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Xiang Lei, Jiading Wu, Huai Zheng, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Huai Zheng, Sheng Liu, Bin Cao, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Yang Peng, Huai Zheng, Sheng Liu, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Jiading Wu, Huai Zheng, Zefeng Zhang, 2017, IEEE Photonics Technology Letters.

Huai Zheng, Sheng Liu, Jie Liu, 2021, IEEE Photonics Technology Letters.

Huai Zheng, Zefeng Zhang, Sheng Liu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Hao Jiang, Chunlin Xu, Sheng Liu, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

Sheng Liu, Shizhao Wang, Yameng Sun, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Sheng Liu, Jie Liu, Jinglong Zou, 2020, Journal of Electronic Packaging.

J. Chu, Huai Zheng, Xiaoliang Zeng, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Huai Zheng, Jau Tang, Sheng Liu, 2018, Scientific Reports.