Y. Qin

Assembly and packaging technologies for high-temperature and high-power GaN HEMTs

J. Wilde, R. Quay, P. Waltereit, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Foil Based Transient Liquid Phase Bonding as a Die-Attachment Method for High Temperature Devices

A. Bajwa, Y. Qin, R. Zeiser, 2014 .

Investigating the effects of process parameters on the cross wedge rolling of TC6 alloy based on temperature and strain rate sensitivities

Y. Qin, S. Fang, Ping Chen, 2019, The International Journal of Advanced Manufacturing Technology.

Residual stress reductions of carbide cutting tools through applying pulsed magnetic field and coupled electromagnetic field – mechanism analysis and comparison study

Wei Wang, Y. Qin, Jigang Huang, 2022, The International Journal of Advanced Manufacturing Technology.

Development of a new machine system for the forming of micro-sheet-products

C. Harrison, Y. Ma, Y. Qin, 2008 .

Improving thermal conductivity of a nickel-based alloy through advanced electromagnetic coupling treatment

Shenmin Zhang, Y. Qin, Qianwen Zhang, 2022, Journal of Materials Research and Technology.