Trey Graves

发表

Comparative stochastic process variation bands for N7, N5, and N3 at EUV

Alessandro Vaglio Pret, Trey Graves, David Blankenship, 2018, Advanced Lithography.

Modeling and simulation of low-energy electron scattering in organic and inorganic EUV photoresists

Alessandro Vaglio Pret, Trey Graves, David Blankenship, 2017, Advanced Lithography.

Rigorous physical modeling of a materials-based frequency doubling lithography process

Trey Graves, John J. Biafore, Stewart A. Robertson, 2008, SPIE Advanced Lithography.

Methods for benchmarking photolithography simulators: part V

Trey Graves, Mark D. Smith, Sanjay H. Kapasi, 2010, Advanced Lithography.

Methods for benchmarking photolithography simulators: part IV

Trey Graves, Chris A. Mack, Mark D. Smith, 2006, SPIE Advanced Lithography.

The modeling of double patterning lithographic processes

Trey Graves, John J. Biafore, Stewart A. Robertson, 2007, SPIE Advanced Lithography.

The impact of mask topography on binary reticles at the 65nm node

Trey Graves, Chris A. Mack, Mark D. Smith, 2004, SPIE Advanced Lithography.

DSA graphoepitaxy calibrations for contact hole multiplication

Alessandro Vaglio Pret, Trey Graves, Stewart Robertson, 2015, Advanced Lithography.

RET selection using rigorous, physics-based computational lithography

Trey Graves, Stewart Robertson, Chris Sallee, 2008, SPIE Advanced Lithography.

Reflectivity metrics for optimization of anti-reflection coatings on wafers with topography

Trey Graves, John J. Biafore, Stewart A. Robertson, 2010, Advanced Lithography.

Investigating the impact of topography on pitch splitting double patterning using rigorous physical simulation

Trey Graves, John J. Biafore, Stewart A. Robertson, 2009, Advanced Lithography.

Topographic and other effects on EUV pattern fidelity

Trey Graves, Mark Neisser, Stewart A. Robertson, 2014, Advanced Lithography.

Methods for benchmarking photolithography simulators: Part III

Trey Graves, Chris A. Mack, Mark D. Smith, 2005, SPIE Photomask Technology.

Statistical simulation of photoresists at EUV and ArF

James W. Thackeray, Trey Graves, David Blankenship, 2009, Advanced Lithography.

Impact of mask line roughness in EUV lithography

Alessandro Vaglio Pret, Trey Graves, Roel Gronheid, 2011, Advanced Lithography.

Evaluating the effect of EUV multilayer buried defects on feature printability using a stochastic resist model

Trey Graves, John J. Biafore, Chao Fang, 2013, Advanced Lithography.

Mechanistic simulation of line-edge roughness

Trey Graves, John J. Biafore, Stewart A. Robertson, 2007, SPIE Advanced Lithography.

Lithographic characterization of evanescent wave imaging systems

Trey Graves, Stewart A. Robertson, Mark D. Smith, 2007, SPIE Advanced Lithography.

Methods for benchmarking photolithography simulators: part III

Trey Graves, Chris A. Mack, Mark D. Smith, 2004, SPIE Advanced Lithography.

Simulation of optical lithography in the presence of topography and spin-coated films

Trey Graves, John J. Biafore, Michael T. Reilly, 2009, Advanced Lithography.

Gaining insight into effective metrology height through the use of a compact CDSEM model for lithography simulation

Alessandro Vaglio Pret, Trey Graves, Stewart Robertson, 2016, SPIE Advanced Lithography.

The impact of optical non-idealities in litho-litho-etch processing

Trey Graves, John J. Biafore, Michael T. Reilly, 2010, Advanced Lithography.

Comprehensive EUV lithography model

Trey Graves, Stewart Robertson, Donggyu Yim, 2011, Advanced Lithography.

OPC strategies to reduce failure rates with rigorous resist model stochastic simulations in EUVL

Alessandro Vaglio Pret, Trey Graves, David Blankenship, 2019, Advanced Lithography.

Quantifying imaging performance bounds of extreme dipole illumination in high NA optical lithography

Trey Graves, John J. Biafore, Mark D. Smith, 2016, Photomask Technology.

The impact of attenuated phase shift mask topography on hyper-NA lithography

Trey Graves, Chris A. Mack, Mark D. Smith, 2005, SPIE Photomask Technology.

Non‐Gaussian CD distribution characterization for DRAM application in EUV lithography

Alessandro Vaglio Pret, Trey Graves, David Blankenship, 2018, Photomask Technology.

Mask absorber roughness impact in extreme ultraviolet lithography

Trey Graves, John J. Biafore, Roel Gronheid, 2011 .