Seong-Jin Kim

A Three-Dimensional Time-of-Flight CMOS Image Sensor With Pinned-Photodiode Pixel Structure

Seong-Jin Kim, Sang-Wook Han, Byongmin Kang, 2010, IEEE Electron Device Letters.

A 5.9µm-pixel 2D/3D image sensor with background suppression over 100klx

E. Yoon, Jihyun Cho, Seong-Jin Kim, 2013, 2013 Symposium on VLSI Circuits.

A Low Noise Single-Slope ADC with Signal-Dependent Multiple Sampling Technique

Bumjun Kim, Seong-Jin Kim, Sanguk Lee, 2019 .

A 2-D/3-D image sensor with PPD-based lock-in pixels(TOF depth map sensors,2nd Asian Image Sensors and Imaging Systems Symposium)

Seong-Jin Kim, Seong-Jin Kim, 2014 .

A modular expandable tactile sensor using flexible polymer

Kwang-Seok Yun, Euisik Yoon, Sun-Il Chang, 2005, 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005..

Real-time label-free quantitative monitoring of biomolecules without surface binding by floating-gate complementary metal-oxide semiconductor sensor array integrated with readout circuitry

Lee-Sup Kim, Euisik Yoon, Maesoon Im, 2007 .

Performance Evaluation of Pinning Potential Adjustment in Two-Dimensional/Three-Dimensional Image Sensor

Seong-Jin Kim, Seong-Jin Kim, 2012, IEEE Electron Device Letters.

A 640×480 image sensor with unified pixel architecture for 2D/3D imaging in 0.11µm CMOS

Chang-Yeong Kim, Seong-Jin Kim, James D. K. Kim, 2011, 2011 Symposium on VLSI Circuits - Digest of Technical Papers.

A 3-D Camera With Adaptable Background Light Suppression Using Pixel-Binning and Super-Resolution

Jaehyuk Choi, Seokjun Park, Jihyun Cho, 2014, IEEE Journal of Solid-State Circuits.

A CMOS Image Sensor Based on Unified Pixel Architecture With Time-Division Multiplexing Scheme for Color and Depth Image Acquisition

Seong-Jin Kim, James D. K. Kim, Byongmin Kang, 2012, IEEE Journal of Solid-State Circuits.

A 1920×1080 3.65μm-pixel 2D/3D image sensor with split and binning pixel structure in 0.11pm standard CMOS

Chang-Yeong Kim, Seong-Jin Kim, James D. K. Kim, 2012, 2012 IEEE International Solid-State Circuits Conference.