Sangbeom Cho

Electrical conductivity and Joule heating of polyacrylonitrile/carbon nanotube composite fibers

Y. Joshi, Satish Kumar, An-Ting Chien, 2014 .

Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation

V. Sundaram, R. Tummala, Y. Joshi, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Venky Sundaram, Rao R. Tummala, Sangbeom Cho, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Comparison of thermal performance between glass and silicon interposers

V. Sundaram, R. Tummala, Yoichiro Sato, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Capillary Performance of Micropillar Arrays in Different Arrangements

R. Tummala, Y. Joshi, Sangbeom Cho, 2018 .

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

Y. Joshi, Sangbeom Cho, 2019, Journal of Heat Transfer.

Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers

V. Sundaram, R. Tummala, Y. Joshi, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).