J. Lombardi

发表

Jing Li, Kanad Ghose, Jin Luo, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Prahalada K. Rao, M. Poliks, J. Lombardi, 2018, Volume 1: Additive Manufacturing; Bio and Sustainable Manufacturing.

B. Hsiao, Susan S. Lu, M. Poliks, 2022, ACS applied materials & interfaces.

Prahalada K. Rao, M. Poliks, J. Lombardi, 2019, Journal of Manufacturing Science and Engineering.

M. Poliks, A. Alizadeh, J. Lombardi, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Brian A. Telek, R. Aga, E. Heckman, 2013, Journal of Electronic Materials.

J. Castracane, N. Tokranova, C. Ventrice, 2019, ACS Applied Electronic Materials.

M. Rafailovich, J. Sokolov, J. Lombardi, 2015 .

John Simonsen, J. Simonsen, J. Lombardi, 2008 .

Jack Lombardi, Glenn D Prestwich, G. Prestwich, 2005, Biomacromolecules.

S. Garner, C. Westgate, M. Poliks, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Hyok J. Song, Timothy Talty, Jack Lombardi, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Prahalad K. Rao, Jack P. Lombardi, Mark D. Poliks, 2020, Journal of Manufacturing Science and Engineering.

M. Marciniak, J. Lombardi, M. Seal, 2014 .

M. Poliks, J. Lombardi, P. Borgesen, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Emily M. Heckman, Carrie M. Bartsch, Roberto S. Aga, 2015, SPIE Security + Defence.

Prahalada K. Rao, M. Poliks, J. Lombardi, 2018, Volume 2: Advanced Manufacturing.

Satyavolu S. Papa Rao, Corbet S. Johnson, J. Mucci, 2023, IEEE Transactions on Quantum Engineering.

Kanad Ghose, James N. Turner, Jack P. Lombardi, 2020, IEEE Transactions on Instrumentation and Measurement.

M. Poliks, J. Iannotti, J. Lombardi, 2018, International Symposium on Microelectronics.

Carrie M. Bartsch, R. S. Aga, E. M. Heckman, 2012, 2012 IEEE 55th International Midwest Symposium on Circuits and Systems (MWSCAS).