P. Jiang

Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder

C. Wei, Li‐Ping Yu, Xin Wang, 2009 .

Enhanced removal and recovery of binary mixture of n-butyl acetate and p-xylene by temperature swing–Vacuum pressure swing hybrid adsorption process

Xingang Li, H. Sui, Lin He, 2020 .

Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate

Zhi Gao, P. Jiang, Chen Wei, 2008 .