Ji Chul Yang

发表

Nano-scale stick-slip friction model for the chatter scratch generated by chemical mechanical polishing process.

B. Yoon, Taesung Kim, H. Kim, 2012, Journal of nanoscience and nanotechnology.

Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish

Taesung Kim, C. L. Song, Taesung Kim, 2010 .

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Taesung Kim, Ji Chul Yang, Hojoong Kim, 2012, Journal of Electronic Materials.

Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes

Taesung Kim, Ji Chul Yang, Chilgee Lee, 2010 .

Investigation on the control of silicon whisker generation during dichlorosilane-based WSi deposition process

Taesung Kim, Hoomi Choi, Ji Chul Yang, 2012 .

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Taesung Kim, Ji Chul Yang, Hojoong Kim, 2010 .

Study of sol-gel type ceria particle for CMP process in leading-edge CMOS device: YE: Yield enhancement/learning

Dinesh K. Penigalapati, D. Koli, Ji Chul Yang, 2017, ASMC 2017.

Study of sol-gel type ceria particle for CMP process in leading-edge CMOS device

Dinesh K. Penigalapati, D. Koli, Ji Chul Yang, 2017, 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO).

Challenges in Chemical Mechanical Planarization defects of 7nm device and its improvement opportunities

Dinesh K. Penigalapati, D. Koli, Ji Chul Yang, 2017, 2017 China Semiconductor Technology International Conference (CSTIC).

Post Cleaning for FEOL CMP with Silica and Ceria Slurries

Ji Chul Yang, Wei-Tsu Tseng, Amarnath Jha, 2017 .

Study of Polishing Characteristics of Monodisperse Ceria Abrasive in Chemical Mechanical Planarization

Taesung Kim, Ji Chul Yang, Hojoong Kim, 2010 .

Effects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing

Myungjoon Kim, Taesung Kim, Ji Chul Yang, 2011 .

Micro/nano-tribological characteristics of self-assembled monolayer and its application in nano-structure fabrication

B. Shin, I. Sung, Dae-Eun Kim, 2003 .

Frictional Characteristic of Polymeric Additive for the Slurry of Chemical Mechanical Planarization Process

Sung Ha Park, Junwye Lee, Taesung Kim, 2012 .