K. Meyyappan

Knowledge based qualification process to evaluate vibration induced failures in Electronic Components

K. Meyyappan, M. Vujosevic, Qifeng Wu, 2018 .

Wire Fatigue Models for Power Electronic Modules

K. Meyyappan, P. McCluskey, P. Hansen, 2003 .

Evaluation of corrosion films on Cu and Ag reactive monitors deployed in data center server environments

B. Pathangey, A. Proctor, K. Meyyappan, 2014, 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm).

Impact of Enabling solution design on SLI reliability during Temperature Cycling using Shadow Moire

P. Geng, K. Meyyappan, I. Hsu, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Application of shadow moire technique to board level manufacturing technologies

P. Geng, T. Bandorawalla, S. Cho, 2006, 56th Electronic Components and Technology Conference 2006.

Corrosion Studies on Gold-Plated Electrical Contacts

B. Pathangey, K. Meyyappan, A. Kurella, 2014, IEEE Transactions on Device and Materials Reliability.

Thermomechanical analysis of gold-based SiC die-attach assembly

Patrick McCluskey, K. Meyyappan, K. Meyyappan, 2003 .

Reliability test induced failures vs field performance: Contact fretting perspective

Karumbu Meyyappan, Milena Vujosevic, Charles Hill, 2017, 2017 IEEE Holm Conference on Electrical Contacts.