Seungjun Noh

The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film

K. Suganuma, Chuantong Chen, Dongjin Kim, 2021 .

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

K. Suganuma, Chuantong Chen, C. Choe, 2018, Materials.

Bonding technology based on solid porous Ag for large area chips

K. Suganuma, J. Jiu, Hao Zhang, 2018 .

Correlations between Electrical Properties and Process Parameters of Silicon Nitride Films Prepared by Low Temperature (100℃) Catalytic CVD

Seungjun Noh, W. Hong, S. Noh, 2015 .

A nearly-perfect Ag joints prepared by novel Ag to Ag direct bonding

K. Suganuma, T. Sugahara, Hao Zhang, 2018, International Conference on Electronic Packaging and iMAPS All Asia Conference.

Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process

K. Suganuma, T. Sugahara, Hao Zhang, 2018, 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste

K. Suganuma, Chuantong Chen, S. Nagao, 2017 .