G. Lefranc

Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

B. Michel, R. Dudek, H. Walter, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Localisation of electrical-insulation- and partial-discharge failures of IGBT modules

G. Lefranc, G. Mitić, Gorana Mitic, 1999, Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370).

IGBT module technology with high partial discharge resistance

G. Mitic, G. Lefranc, T. Licht, 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).

The thermal impedance of new power semiconductor modules using AlN substrates

G. Mitic, G. Lefranc, D. Dieci, 1998, Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242).