J. Sercu

Full-wave space-domain analysis of open microstrip discontinuities including the singular current-edge behavior

D. Zutter, J. Sercu, N. Faché, 1993 .

First-order rooftop functions for the current discretisation in the method of moments solution of planar structures

P. Lagasse, J. Sercu, N. Faché, 1994, Proceedings of IEEE Antennas and Propagation Society International Symposium and URSI National Radio Science Meeting.

A full wave space domain analysis technique of open microstrip planar circuits

D. De Zutter, J. Sercu, N. Faché, 1992, IEEE Antennas and Propagation Society International Symposium 1992 Digest.

New approaches to increase the efficiency of the electromagnetic modeling of planar RF and microwave circuits

Daniël De Zutter, Tom Dhaene, J. Sercu, 2001 .

Efficient MoM techniques for complex digital high-speed and RF-circuits and for parametrized model building

Daniël De Zutter, Tom Dhaene, J. Sercu, 2002, Intelligent Memory Systems.

Modeling of through-silicon via's (TSV) with a 3D planar integral equation solver

J. Sercu, T. Schwartzmann, 2014, 2014 International Conference on Numerical Electromagnetic Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO).

Rigorous Analysis of Internal Resonances in 3-D Hybrid FE-BIE Formulations by Means of the Poincaré–Steklov Operator

Hendrik Rogier, Freek Boeykens, Jeannick Sercu, 2013, IEEE Transactions on Microwave Theory and Techniques.

Recent trends in the integration of circuit optimization and full-wave electromagnetic analysis

T. Dhaene, D. De Zutter, J. Sercu, 2004, IEEE Transactions on Microwave Theory and Techniques.

Optimization strategies for planar microwave circuits

Daniël De Zutter, Tom Dhaene, J. De Geest, 2003, IMS 2003.

A Calderón multiplicative preconditioner for the electromagnetic Poincaré-Steklov operator of a heterogeneous domain with scattering applications

H. Rogier, J. Sercu, D. De Zutter, 2015, J. Comput. Phys..

Surface Current Modelling of the Skin Effect for On-Chip Interconnections

H. Rogier, J. Sercu, L. Knockaert, 2007, IEEE Transactions on Advanced Packaging.