Yao-Jen Chang

Utilizing Single Lightwave for Delivering Baseband/FSO/MMW Traffics Simultaneously in PON Architecture

Chien-Hung Yeh, Chi-Wai Chow, Wen-Piao Lin, 2019, IEEE Access.

Intra prediction using multiple reference lines for the versatile video coding standard

Liang Zhao, Heiko Schwarz, Detlev Marpe, 2019, Optical Engineering + Applications.

A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

Shyh-Shyuan Sheu, Kuan-Neng Chen, Yao-Jen Chang, 2012, IEEE Transactions on Device and Materials Reliability.

Prediction of the Composition and Hardness of High-Entropy Alloys by Machine Learning

Yao-Jen Chang, An-Chou Yeh, Yao-Jen Chang, 2019, JOM.

Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme

Kuan-Neng Chen, Yao-Jen Chang, Cheng-Ta Ko, 2013, IEEE Electron Device Letters.

Effect of Ta thickness on the perpendicular magnetic anisotropy in MgO/CoFeB/Ta/[Co/Pd]n structures

Yao-Jen Chang, Yang-Hua Chang, A. Canizo-Cabrera, 2013 .

Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration

Yu-Sheng Hsieh, Kuan-Neng Chen, Yao-Jen Chang, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid Bonding

Kuan-Neng Chen, Yao-Jen Chang, Cheng-Hao Chiang, 2013, IEEE Electron Device Letters.

Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application

Yu-Sheng Hsieh, Kuan-Neng Chen, Yao-Jen Chang, 2015, IEEE Transactions on Device and Materials Reliability.

Characteristics of Zr-Doped ZnO Thin Films Grown by Atomic Layer Deposition

Yao-Jen Chang, Miin-Jang Chen, Miin-Jang Chen, 2011 .