C. Steinbrüchel

发表

Universal energy dependence of physical and ion-enhanced chemical etch yields at low ion energy

C. Steinbrüchel, 1989 .

Absolute measurement of sputtered ion fractions using matrix isolation spectroscopy

D. Gruen, C. Steinbrüchel, 1980 .

Kinetics of Reactive Ion Etching of Polymers in an Oxygen Plasma: The Importance of Direct Reactive Ion Etching

C. Steinbrüchel, S. Graham, 1993 .

Mechanism of Reactive Ion Etching of Polymeric Films in Oxygen-Based Plasmas

C. Steinbrüchel, S. Graham, 1992 .

The Role of F Atoms in the Reactive Sputter Etching of Silicon Dioxide: Langmuir Probe and Optical Actinometry Measurements

B. J. Curtis, C. Steinbrüchel, 1986 .

Mechanism of Dry Etching of Silicon Dioxide A Case of Direct Reactive Ion Etching

H. W. Lehmann, H. Lehmann, C. Steinbrüchel, 1985 .

Plasma etching of benzocyclobutene in CF4/O2 and SF6/O2 plasmas

C. Steinbrüchel, G. Kim, 2006 .

TiN, TaN and WxN as diffusion barriers for Cu on SiO2: capacitance-voltage, leakage current, and triangular-voltage-sweep tests after bias temperature stress

H. Kizil, C. Steinbrüchel, 2004 .

On the interpretation of adsorption and desorption kinetics experiments

C. Steinbrüchel, 1975 .

The adsorption of CO on the (110) plane of tungsten; LEED, XPS, and Auger measurements

R. Gomer, C. Steinbrüchel, 1977 .

Patterning of Benzocyclobutene by Reactive Ion Etching

C. Steinbrüchel, R. Tacito, 1996 .

Non-destructive, interferometric method for measuring the thickness of a silicon membrane

C. Steinbrüchel, J. M. Adee, 1997 .

Electrical Behavior of Cu Thin Fluorinated PECVD Oxide MIS Capacitors

S. Murarka, H. Bakhru, C. Steinbrüchel, 2000 .

Ion Beam Techniques for Low K Materials Characterization

P. Wayner, J. McDonald, S. Nitta, 1998 .

Metal/fluorinated-dielectric interactions in microelectronic interconnections: Rapid diffusion of fluorine through aluminum

C. Steinbrüchel, Seongyul Kim, 1999 .

TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology

Gusung T. Kim, Bin Zhao, H. Kizil, 2001 .

Fabrication of Dual-Damascene Structures in Low Dielectric Constant Polymers for Multilevel Interconnects

C. Steinbrüchel, R. Tacito, 1996 .

Reactive ion etching of copper in SiCl4‐based plasmas

C. Steinbrüchel, B. J. Howard, 1991 .

Reactive Ion Etching of Copper with SiCl 4 and CCl 2 F 2

W. Yoo, C. Steinbrüchel, B. Gittleman, 1990 .

Model calculation of gas-surface energy accommodation coefficients: The importance of multiple collisions and of trapping

C. Steinbrüchel, 1977 .

The Formation of Particles in Thin-Film Processing Plasmas

C. Steinbrüchel, 1994 .

Physical and Chemical Sputtering at Very Low Ion Energy: the Importance of the Sputtering Threshold

C. Steinbrüchel, 1988 .

A simple formula for low-energy sputtering yields

C. Steinbrüchel, 1985 .

Characterization of ultrathin gate dielectrics formed by in-situ steam generation with nitrogen postprocessing

H. Huff, A. Karamcheti, T. Luo, 2002 .

Gas-surface scattering distributions according to the hard-spheroid model

C. Steinbrüchel, 1982 .

Condensation of gases on metals: The one-dimensional square well model

L. Schmidt, C. Steinbrüchel, 1973 .

Isotope effects in electron impact desorption of CO and O2 adsorbed on the (110) plane of tungsten

R. Gomer, C. Steinbrüchel, C. Leung, 1977 .

Limitations of kinetic studies of catalytic reactions on a single‐crystal surface at low pressures in a UHV system

G. Somorjai, C. Steinbrüchel, 1976 .

Kinetics of photo-induced diffusion and clustering of matrix isolated metal atoms

D. Gruen, C. Steinbrüchel, 1981 .

Matrix isolation spectra of metal atoms and ions: Ti, Zr, and Mo in Ar and Kr

D. Gruen, C. Steinbrüchel, 1981 .

Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

C. Steinbrüchel, 1995 .

Parametrization of Laframboise’s results for spherical and cylindrical Langmuir probes

A. Karamcheti, C. Steinbrüchel, 1999 .

Langmuir Probe Measurements on CHF 3 and CF 4 Plasmas: The Role of Ions in the Reactive Sputter Etching of SiO2 and Si

C. Steinbrüchel, Ch. Steinbrüchel, 1983 .

A new method for analyzing Langmuir probe data and the determination of ion densities and etch yields in an etching plasma

C. Steinbrüchel, Christoph Steinbrüchel, 1990 .

The scattering of phonons of arbitrary wavelength at a solid-solid interface: Model calculation and applications

C. Steinbrüchel, 1976 .

Energy transfer in adsorption. I. Experiments

L. Schmidt, C. Steinbrüchel, 1974 .

Relative sticking coefficients of H2 and D2 on tungsten

L. Schmidt, C. Steinbrüchel, S. Ko, 1974 .

Hardness and Tribological Effects of Ion Implantation on Electroplated Chromium

C. Steinbrüchel, Kathryn Noll, 1994 .

Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu NH 3 Bath

D. Duquette, C. Steinbrüchel, L. Graham, 2002 .

Oxygen adsorption on the tungsten (110) plane. Electron impact and thermal desorption at high temperatures

R. Gomer, C. Steinbrüchel, 1978 .

The Importance of Self-Sputtering by Low Energy Ions in Partially Ionized Beam Deposition

T. Lu, C. Steinbrüchel, P. Bai, 1989 .

Etch mechanism in the reactive ion etching of silicon nitride

C. Steinbrüchel, J. Dulak, B. J. Howard, 1991 .

The hard-spheroid model for gas-surface interactions

C. Steinbrüchel, 1980 .

Analysis of Langmuir probe data: Analytical parametrization, and the importance of the end effect

C. Steinbrüchel, G. Narasimhan, 2001 .

Temperature-compensated composite thin-film resistors

C. Steinbrüchel, A. Razborsek, 1990 .

A citation index for principal investigators

C. Steinbrüchel, 2018, Scientometrics.

Energy transfer in adsorption. II. Model calculations

L. Schmidt, C. Steinbrüchel, 1974 .

Growth of plasma‐generated particles and behavior of particle clouds during sputtering of silicon and silicon dioxide

W. Yoo, C. Steinbrüchel, 1993 .

Kinetics of particle formation in the sputtering and reactive ion etching of silicon

W. Yoo, C. Steinbrüchel, 1992 .

Heat dissipation in catalytic reactions on supported crystallites

L. Schmidt, C. Steinbrüchel, 1973 .

Reactive ion etching of copper with BCl3 and SiCl4: Plasma diagnostics and patterning

C. Steinbrüchel, B. J. Howard, 1994 .

Desorption kinetics of one- and two-step mechanisms

C. Steinbrüchel, 1979 .

hPI: The Citation Index for Principal Investigators

Christoph Steinbruchel, C. Steinbrüchel, 2018, ArXiv.