H. Nishino

Damage‐free selective etching of Si native oxides using NH3/NF3 and SF6/H2O down‐flow etching

H. Nishino, N. Hayasaka, H. Okano, 1993 .

Down-Flow Process in VLSI Manufacturing

T. Arikado, H. Nishino, N. Hayasaka, 1988 .

Force Driving Cu Diffusion into Interlayer Dielectrics

H. Nishino, A. Matsuura, H. Matsunaga, 2002 .

Silicon crystal heating and thermocouple mounting designs

W. J. Choyke, J. Yates, Z. Dohnálek, 1997 .

Intriguing kinetics for chlorine etching of the Si(100)-(2×1) surface

J. Yates, Z. Dohnálek, H. Nishino, 1999 .

Analysis of Leakage Current in Cu/SiO2/Si/Al Capacitors under Bias-Temperature Stress

H. Nishino, H. Matsunaga, T. Fukuda, 2003 .