Hong Yu Li
发表
Jinglin Shi,
R. Weerasekera,
Hong Yu Li,
2013,
IEEE Electron Device Letters.
Xiaowu Zhang,
Hong Yu Li,
Y. S. Chan,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Tai Chong Chai,
Shiguo Liu,
Yue Ying Ong,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Chee Lip Gan,
Chuan Seng Tan,
Riko I Made,
2013
.
Chuan Seng Tan,
Jiye Zhang,
Guangrui Xia,
2015,
IEEE Transactions on Device and Materials Reliability.
Chuan Seng Tan,
Dau Fatt Lim,
Lan Peng,
2012,
IEEE Electron Device Letters.
Chee Lip Gan,
Chuan Seng Tan,
Riko I Made,
2011,
2011 IEEE International Interconnect Technology Conference.
Chuan Seng Tan,
Lan Peng,
Lin Zhang,
2013,
IEEE Transactions on Electron Devices.
Roshan Weerasekera,
Joseph Romen Cubillo,
Ka Fai Chang,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Shan Gao,
Hong Yu Li,
Jaesik Lee,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Srinivasa Rao Vempati,
Ser Choong Chong,
Daniel Ismael Cereno,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Chuan Seng Tan,
Dau Fatt Lim,
Lan Peng,
2011,
IEEE Electron Device Letters.
Shan Gao,
Jaesik Lee,
Y. Yeo,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Balamurugan,
A. Sundarrajan,
Junqi Wei,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Khan,
L. Lim,
Hong Yu Li,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
F. Che,
M. Kawano,
Hong Yu Li,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Che,
M. Kawano,
Hong Yu Li,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
D. F. Lim,
C. S. Tan,
Lan Peng,
2012,
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.
Soon-Wook Kim,
Gil-Ho Hwang,
Hong Yu Li,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. S. Tan,
L. Guidoni,
Hong Yu Li,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
C. S. Tan,
L. Guidoni,
Hong Yu Li,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
D. F. Lim,
C. S. Tan,
Shan Gao,
2011
.
S. Yoon,
M. Iyer,
V. Kripesh,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
C. S. Tan,
L. Guidoni,
Hong Yu Li,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
C. S. Tan,
L. Guidoni,
Hong Yu Li,
2020,
2020 Conference on Lasers and Electro-Optics (CLEO).
Anak Agung Alit Apriyana,
C. S. Tan,
L. Guidoni,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. S. Tan,
Liangxing Hu,
L. Guidoni,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
C. S. Tan,
L. Guidoni,
Hong Yu Li,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Gao Shan,
Hong Yu Li,
J. Rantala,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
C. S. Tan,
Hong Yu Li,
Ye Lin,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Lin Zhang,
Hong Yu Li,
Y. Shang,
2016
.
C. S. Tan,
G. Xia,
Hong Yu Li,
2016,
1601.04107.
J. Likforman,
C. S. Tan,
L. Guidoni,
2021,
physica status solidi (b).
Xiaowu Zhang,
Hong Yu Li,
Y. S. Chan,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
C. S. Tan,
Hong Yu Li,
Y. Lim,
2021
.