S. Parikh

Defect and electromigration characterization of a two level copper interconnect

Robin W. Cheung, G. Dixit, J. Educato, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Process integration of double level copper-low k (k=2.8) interconnect

D. Cheung, D. Yost, I. Hashim, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

TiN barrier integrity and volcano formation in W-plug applications

S. Parikh, L. Akselrod, N. Parekh, 1998 .