M. Yim

发表

K. Paik, M. Yim, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

R. Tummala, C. Wong, M. Iyer, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Paul A. Lauro, Da-Yuan Shih, Karl J. Puttlitz, 2001, ECTC 2001.

Yi Li, K. Moon, C. Wong, 2009, IEEE Transactions on Components and Packaging Technologies.

D. Baldwin, S. Lee, M. Yim, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

C. Wong, D. Baldwin, M. Yim, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Myung Jin Yim, K. Paik, M. Yim, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

C. Wong, Wei Lin, Hongjin Jiang, 2008, IEEE Transactions on Components and Packaging Technologies.

K. Moon, C. Wong, Hongjin Jiang, 2009, 2008 58th Electronic Components and Technology Conference.

E. Yoon, Kisu Joo, B. Lee, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

C.P. Wong, M. Swaminathan, P. Markondeya Raj, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

H.-Y Son, K. Paik, C. Chung, 2007, IEEE transactions on electronics packaging manufacturing (Print).

K. Paik, M. Yim, H. -. Kim, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Woon-Seong Kwon, Kyung-Wook Paik, Kijoong Kim, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Chang-Kyu Chung, Myung Jin Yim, K. Paik, 2007, IEEE Transactions on Electronics Packaging Manufacturing.

K. Paik, M. Yim, Young-Doo Jeon, 1999, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Kiwon Lee, Kyung-Wook Paik, K. Paik, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Ki Won Lee, Hyoung Joon Kim, Myung Jin Yim, 2006, 56th Electronic Components and Technology Conference 2006.

M. Yim, R. Strode, Ravikumar Adimula, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

C.P. Wong, S. Lee, C. Wong, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Yi Li, K. Moon, C. Wong, 2008, 2008 58th Electronic Components and Technology Conference.

Yi Li, C. Wong, M. Yim, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Yi Li, C.P. Wong, Myung Jin Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Yi Li, C. Wong, M. Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Joungho Kim, Woonghwan Ryu, Kyung-Wook Paik, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

K. Paik, M. Yim, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).