Yin-Po Hung

A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

W. Lo, Hsien-Chie Cheng, Chao-Kai Hsu, 2008, 2008 58th Electronic Components and Technology Conference.

Board-level reliability of coreless flip chip package assembled on a printed circuit board

Tao-Chih Chang, C. Zhan, J. Chou, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Processing characteristics and reliability of embedded DDR2 memory chips

Tao-Chih Chang, Chao-Kai Hsu, Yin-Po Hung, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance

Yin-Po Hung, Li-Cheng Shen, Tao-Chih Chang, 2008, 2008 58th Electronic Components and Technology Conference.

Influence of underfill materials on the reliability of coreless flip chip package

Yin-Po Hung, Tao-Chih Chang, Yu-Min Lin, 2008, Microelectron. Reliab..

The Translational and Regulatory Development of an Implantable Microdevice for Multiple Drug Sensitivity Measurements in Cancer Patients

Nobuhiko Hata, Adam S. Kibel, Pierpaolo Peruzzi, 2021, IEEE Transactions on Biomedical Engineering.

Flex circuit depaneling in thin film polymer using dry etching technology

C. Ko, Yin-Po Hung, Kai-Ming Yang, 2016, 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking

Tao-Chih Chang, K. Kao, Yin-Po Hung, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Achievement of low temperature chip stacking by a wafer-applied underfill material

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Process characteristics of a 2.5D silicon module using embedded technology as a feasible solution for system integration and thinner form-factor

Yu-Min Lin, Tao-Chih Chang, T. Kuo, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.