H. Liem

A 5.8GHz low-IF multi-data rate GFSK transceiver with clock recovery and integrated 21dBm power amplifier

W. Roberts, C. Quek, S. Farahvash, 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

H. Liem, K. C. Yung, H. S. Choy, 2011 .

Thermal investigation of a high brightness LED array package assembly for various placement algorithms

H. Liem, K. C. Yung, H. S. Choy, 2014 .

Multiresponse Optimization of Surface Plasma Treatment Using Taguchi Method

T. M. Yue, H. Liem, K. C. Yung, 2010 .

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

H. Liem, Kam Chuen Yung, K. Yung, 2007 .

Heat transfer analysis of a high-brightness LED array on PCB under different placement configurations

H. Liem, K. C. Yung, H. S. Choy, 2014 .

Superior thermal conductivity of polymer nanocomposites by using graphene and boron nitride as fillers

H. Liem, H. S. Choy, H. Liem, 2013 .

Thermal performance of high brightness LED array package on PCB

H. Liem, K. C. Yung, H. S. Choy, 2010 .