T. Hsu

发表

Evaluation of properties of Ta–Ni amorphous thin film for copper metallization in integrated circuits

J. Fang, T. Hsu, M. L. Ker, 2008 .

Electrical measurement of a lead-free solder assembly after environmental tests by SEM internal probing

J. Duh, T. Hsu, T. Shih, 2007 .

Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization

J. Fang, T. Hsu, Giin-Shan Chen, 2003 .

STUDY OF INCIPIENT MELTING AND STRESS RUPTURE PROPERTIES IN IRON-BASED SUPERALLOY A 286

Hwa-Teng Lee, T. Hsu, Wenkao Hou, 2018 .

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

T. Hsu, Toung-Yi Shih, Yu-ren Lin, 2006 .

Crystallization and failure behavior of Ta-TM (TM=Fe, Co) nanostructured/amorphous diffusion barriers for copper metallization

J. Fang, T. Hsu, Giin-Shan Chen, 2006 .

Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection

J. Fang, T. Hsu, H. C. Chen, 2007 .