Xuejun Fan

发表

Optimal Design of Life Testing for White LEDs Using the Six Sigma DMAIC Approach High-Brightness

Michael Pecht, Guoqi Zhang, Cheng Qian, 2015 .

A review of small heat pipes for electronics

Tian-Ling Ren, Xuejun Fan, Huaiyu Ye, 2016 .

Xuejun Fan, W. D. van Driel, Kouchi Zhang, 2004 .

A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Bo Sun, Guoqi Zhang, Jiajie Fan, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Modeling nonlinear moisture diffusion in inhomogeneous media

Jiang Zhou, G. Q. Zhang, Xuejun Fan, 2017, Microelectron. Reliab..

Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

Cheng Qian, Jiajie Fan, Xuejun Fan, 2019, IEEE Access.

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging

Jiang Zhou, G. Q. Zhang, Cheng Qian, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method

Jiajie Fan, Xuejun Fan, Guoqi Zhang, 2017, Microelectron. Reliab..

Application of 3-D CAD and 3-D Printing to RET Program to Enrich Engineering Design Education

Dorothy A. Sisk, Xianchang Li, Xuejun Fan, 2020 .

A Novel Method of Cooling Channel Optimization for Active-Cooled Structure Using the Calculus of Variations

Li Xuan, Xuejun Fan, Yang Lu, 2019, AIAA Propulsion and Energy 2019 Forum.

Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact

Xuejun Fan, A. S. Ranouta, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A Reliability Prediction Methodology for LED Arrays

Bo Sun, Guoqi Zhang, Guohao Zhang, 2019, IEEE Access.

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Yang Liu, G. Q. Zhang, Hao Zhang, 2018, Microelectron. Reliab..

Shock performance study of solder joints in wafer level packages

Xuejun Fan, Qiang Han, Amarinder Singh Ranouta, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration

Xuejun Fan, Xuejun Fan, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene

G. Q. Zhang, Dao-Guo Yang, Miao Cai, 2018, Sensors.

Study of turbulent heat transfer of aviation kerosene flows in a curved pipe at supercritical pressure

Xuejun Fan, Xiulan Huai, Jun Cai, 2010 .

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Winco K. C. Yung, Xuejun Fan, Guoqi Zhang, 2020, Laser & Photonics Reviews.

PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers

Bo Sun, G. Q. Zhang, Cheng Qian, 2016, IEEE Transactions on Industrial Electronics.

Validation of the methodology of lumen depreciation acceleration of LED lighting

Bo Sun, Bo Li, Cadmus Yuan, 2013, 2013 10th China International Forum on Solid State Lighting (ChinaSSL).

Modeling techniques for board level drop test for a wafer-level package

Tiao Zhou, Xuejun Fan, H.S. Dhiman, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Product level accelerated lifetime test for indoor LED luminaires

Bo Sun, Xuejun Fan, S. Koh, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Lumen decay prediction in LED lamps

Bo Sun, Guoqi Zhang, Xuejun Fan, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

LED's luminous flux lifetime prediction using a hybrid numerical approach

Xuejun Fan, Liangbiao Chen, Kasemsak Kijkanjanapaiboon, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

Bo Sun, Guoqi Zhang, Xuejun Fan, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Improved Lawnmower Blade Design and Optimization

Robert White, Xuejun Fan, Paul Corder, 2009 .

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

G. Q. Zhang, Cheng Qian, Jianwu Cao, 2018, Microelectron. Reliab..

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method

Guoqi Zhang, Cheng Qian, Jiajie Fan, 2017, IEEE Access.

JEDEC board drop test simulation for wafer level packages (WLPs)

Tiao Zhou, Xuejun Fan, Harpreet S. Dhiman, 2009, 2009 59th Electronic Components and Technology Conference.

A systematic approach for reliability assessment of electrolytic capacitor-free LED drivers

Bo Sun, Guoqi Zhang, Xuejun Fan, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields

Bao Li, Song Tian, Xuejun Fan, 2019, ACISP.

Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling

G. Q. Zhang, J. Zhou, Xuejun Fan, 2004, Microelectron. Reliab..

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

G. Q. Zhang, Dao-Guo Yang, Xuejun Fan, 2015, Microelectron. Reliab..

A comparative study of elliptical and round scramjet combustors by Improved Delayed Detached Eddy Simulation

Wei Yao, Xuejun Fan, XJ Fan, 2017 .

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

Bo Sun, Guoqi Zhang, Cadmus Yuan, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Thermal analysis and optimization of IGBT power electronic module based on layout model

Guoqi Zhang, Mingming Wang, Xuejun Fan, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Color shift acceleration on mid-power LED packages

Willem D. van Driel, G. Q. Zhang, Cheng Qian, 2017, Microelectron. Reliab..

A PoF and statistics combined reliability prediction for LED arrays in lamps

Cheng Qian, Jiajie Fan, Xuejun Fan, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Speeding up Scalar Multiplication on Koblitz Curves Using \mu _4 Coordinates

Bao Li, Wei Yu, Xuejun Fan, 2019, ACISP.

EFFECT OF SYSTEM DESIGN AND TEST CONDITIONS ON WAFER LEVEL PACKAGE DROP TEST RELIABILITY

Xuejun Fan, Tiao Zhou, 2013 .

A hybrid prediction method on luminous flux maintenance of high-power LED lamps

Wenbin Chen, Guoqi Zhang, Miao Cai, 2016 .

A POF based breakdown method for LED lighting color shift reliability

M. Yazdan Mehr, Cheng Qian, Jiajie Fan, 2015, 2015 12th China International Forum on Solid State Lighting (SSLCHINA).

Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages

G. Q. Zhang, Cheng Qian, Jiajie Fan, 2017, Microelectron. Reliab..

Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network

Jie Liu, Xuejun Fan, Guoqi Zhang, 2020, IEEE Electron Device Letters.

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

Bo Sun, Willem D. van Driel, G. Q. Zhang, 2017, Reliab. Eng. Syst. Saf..

Cause analysis on highly depreciated indoor LED product in CSA020

Hongyu Tang, Cadmus Yuan, Xuejun Fan, 2013, 2013 10th China International Forum on Solid State Lighting (ChinaSSL).

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

Xuejun Fan, Mark D. Placette, Darvin Edwards, 2012, Microelectron. Reliab..

THE THEORETICAL AND EXPERIMENTAL INVESTIGATION OF THE HEAT TRANSFER PROCESS OF AN AUTOMOBILE RADIATOR

Xuejun Fan, Austin Miller, Matthew Carl, 2012 .

Fatigue failure modeling of wire bonds of high power LED packages with a multiphysics simulation method

Guoqi Zhang, Bin Tang, Cheng Qian, 2016, 2016 13th China International Forum on Solid State Lighting (SSLChina).

Advances in Wafer Level Packaging (WLP)

Yi-Shao Lai, Xuejun Fan, Tong Yan Tee, 2010, Microelectron. Reliab..

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

G. Q. Zhang, Dao-Guo Yang, Xuejun Fan, 2016, Reliab. Eng. Syst. Saf..

Optimal Design of Life Testing for High-Brightness White LEDs Using the Six Sigma DMAIC Approach

Michael Pecht, Guoqi Zhang, Cheng Qian, 2015, IEEE Transactions on Device and Materials Reliability.

Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model.

Wei Chen, Jiajie Fan, Xuejun Fan, 2020, Optics express.

Engineering Design and Manufacturing Education through Research Experience for High School Teachers

Weihang Zhu, Xianchang Li, Xuejun Fan, 2018 .

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

G. Q. Zhang, Hongyu Tang, Jiajie Fan, 2017, Microelectron. Reliab..

Luminous flux modeling for high power LED automotive headlamp module

Guoqi Zhang, Cheng Qian, Jiajie Fan, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach

Michael Pecht, Guoqi Zhang, Cheng Qian, 2017, Materials.

Fault Diagnostics and Lifetime Prognostics for Phosphor-Converted White LED Packages

Michael Pecht, Guoqi Zhang, Cheng Qian, 2018 .

Large-Eddy Simulation of Time Evolution and Instability of Highly Underexpanded Sonic Jets

Wei Yao, Xiaopeng Li, Xuejun Fan, 2016 .

Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode

Cheng Qian, Yutong Li, Jiajie Fan, 2020, IEEE Photonics Journal.

A stochastic process based reliability prediction method for LED driver

Bo Sun, Willem D. van Driel, G. Q. Zhang, 2018, Reliab. Eng. Syst. Saf..

System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

Guoqi Zhang, Winco K.C. Yung, Xuejun Fan, 2021 .

Color Shift Investigations for LED Secondary Optical Designs: Comparison between BPA-PC and PMMA

M. Yazdan Mehr, Xuejun Fan, Guangjun Lu, 2015 .

Solid State Lighting Reliability Part 2

Guoqi Zhang, Xuejun Fan, Willem van Driel, 2018 .

Analysis of photoluminescence mechanisms and thermal quenching effects for multicolor phosphor films used in high color rendering white LEDs

Guoqi Zhang, Jiajie Fan, Xuejun Fan, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation

Mengni Zhang, Guoqi Zhang, Jiajie Fan, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study

Guoqi Zhang, Xuejun Fan, Huaiyu Ye, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Rapid Degradation of Mid-Power White-Light LEDs in Saturated Moisture Conditions

Xuejun Fan, Jianlin Huang, Sau Koh, 2015, IEEE Transactions on Device and Materials Reliability.

A degradation model of aluminum electrolytic capacitors for LED drivers

Bo Sun, Guoqi Zhang, Xuejun Fan, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

Xuejun Fan, Guo Qi Zhang, Henk van Zeijl, 2016 .

A Novel Interconnected Structure of Graphene-Carbon Nanotubes for the Application of Methane Adsorption

Miao Cai, Ning Yang, Xuejun Fan, 2018, IEEE Sensors Journal.