Daniel Lu

Materials for Advanced Packaging

Daniel Lu, Ching-Ping Wong, D. Lu, 2008 .

Accurately predicting copper interconnect topographies in foundry design for manufacturability flows

Linda Zhuang, Philippe Hurat, Li-Fu Chang, 2011, Advanced Lithography.

Improving copper CMP topography by dummy metal fill co-optimizing electroplating and CMP planarization

Li-Fu Chang, Daniel Lu, Zhong Fan, 2010, Advanced Lithography.

Recent advances on chip-to-chip optical interconnect

Daniel Lu, 2009, Photonics and Optoelectronics Meetings.

Post-Silicon Design Methodology on Chip Power Characterization, Validation, and Debug Applied on High Performance Per Watt Microprocessor

Daniel Lu, Gang Yuan, Y.-C.S. Chen, 2007, 2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT).

IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

Cemal Basaran, Flavio Canavero, Ephraim Suhir, 2010 .

Electrical Conductive Adhesives with Nanotechnologies

Daniel Lu, Ching-Ping Wong, Yi Li, 2010 .

Anisotropically Conductive Adhesives/Films (ACA/ACF)

Daniel Lu, Ching-Ping Wong, Yi Li, 2010 .