Michael Bernasch

Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy

M. Petzold, S. Brand, S. Tismer, 2013 .

Influence of the frequency on fatigue of directly wafer-bonded silicon

J. Bagdahn, M. Petzold, Michael Bernasch, 2006 .

Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration

S. Carniello, M. Petzold, J. Siegert, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.