Y. Cheng

Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging

K. Najafi, Y. Cheng, L. Lin, 1998, Journal of Microelectromechanical Systems.

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

K. Najafi, C. Nguyen, W. Hsu, 2002, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

Synthesis and device fabrication of Cu-Ni nanocomposite for low power magnetic microactuation

Y. Cheng, T. Chao, Y. Huang, 2007, 2007 7th IEEE Conference on Nanotechnology (IEEE NANO).

Young's modulus and fatigue lifetime improvements by diamond size effect on electroplated Ni-diamond nanocomposite

Y. Cheng, C. Huang, C. Yeh, 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

K. Najafi, Liwei Lin, C. Nguyen, 2002, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

The influence of Cr content on the phase structure of the Al-rich Al-Cr-O films deposited by magnetron sputtering at low temperature

Y. Cheng, D. Jiao, X. Zhong, 2019, Ceramics International.

The Role of Hydrogen Atmosphere on the Tribological Behavior of Non-Hydrogenated DLC Coatings against Aluminum

A. Alpas, J. Dasch, Y. Cheng, 2007 .

Ni-P-CNTs nanocomposite film for MEMS applications

Wensyang Hsu, Y.T. Cheng, Tzu-Yuan Chao, 2004, 4th IEEE Conference on Nanotechnology, 2004..

Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments

Liwei Lin, Yu-Ting Cheng, C. Chiu, 1998 .