H. Yang

A low-temperature wafer bonding technique using patternable materials

Hsiharng Yang, H. Chou, C. Pan, 2002 .

Workpiece surface quality when ultra-precision turning of SiCp/Al composites

Yucan Fu, Jiuhua Xu, YongCheng Ge, 2008 .

Modeling of curved diamond wheel errors for improvement of freeform grinding accuracy

H. Yang, Jinhong Xie, J. X. Sun, 2019, The International Journal of Advanced Manufacturing Technology.

A promising thermal pressing used in fabricating microlens array

Hsiharng Yang, R. Shyu, H. Yang, 2008 .

PET polymer ablation using excimer laser for nozzle plate application

F. Chang, H. Yang, M. Wei, 2007 .

248 nm excimer laser drilling PI film for nozzle plate application

H. Yang, M. Wei, C. Pan, 2007 .

High-performance inductors using capillary based fluidic self-assembly

K. L. Scott, R. Howe, A. Niknejad, 2004, Journal of Microelectromechanical Systems.

New electroforming technology pressure aid for LIGA process

Hsiharng Yang, Reiyu Chein, Hsiharng Yang, 2004 .

Fabrication of microlens array with graduated sags using UV proximity printing method

C.-P. Lin, H. Yang, C.-K. Chao, 2005 .