Hsueh-An Yang

Localized induction heating solder bonding for wafer level MEMS packaging

W. Fang, Mingching Wu, Hsueh-An Yang, 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.

Localized induction heating solder bonding for wafer level MEMS packaging

Ming C. Wu, W. Fang, Hsueh-An Yang, 2005 .

A Magnetic Repulsive Force MEMS Actuator

W. Fang, Hsueh-An Yang, Tsung-Lin Tang, 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

Improvement of bonding time and quality of anodic bonding using the spiral arrangement of multiple point electrodes

Jung-Tang Huang, Jung-Tang Huang, Hsueh-An Yang, 2002 .

Hemispherical wineglass resonators fabricated from the microcrystalline diamond

D. Horsley, K. Yamazaki, Liwei Lin, 2013 .

Integration of the fabrication processes and wafer level packaging of MEMS devices using localized induction heating

Ming C. Wu, W. Fang, Hsueh-An Yang, 2003, 2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682).

High quality factor nanocrystalline diamond micromechanical resonators limited by thermoelastic damping

D. Horsley, Liwei Lin, D. Cahill, 2014 .

On the selective magnetic induction heating of micron scale structures

W. Fang, Hsueh-An Yang, Chiung-Wen Lin, 2006 .

Micromachined polycrystalline diamond hemispherical shell resonators

D. A. Horsley, D. Horsley, K. Yamazaki, 2012, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Corrigendum: Hemispherical wineglass resonators fabricated from the microcrystalline diamond (2013 J. Micromech. Microeng. 23 125016)

D. Horsley, K. Yamazaki, Liwei Lin, 2014 .