S. Seok

发表

Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications

N. Rolland, P. Rolland, S. Seok, 2007, IEEE Transactions on Microwave Theory and Techniques.

Mechanical and Electrical Characterization of Benzocyclobutene Membrane Packaging

N. Rolland, P. Rolland, S. Seok, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Jinseok Kim, S. Seok, HyungDal Park, 2020, Micromachines.

Wafer-level packaging technology for RF MEMS

S. Seok, 2013 .

Fabrication and Modeling of Nitride Thin Film Encapsulation Based on Anti-Adhesion-Assisted Transfer Technique and Nitride/BCB Bilayer Wrinkling

S. Seok, 2016, ECTC 2016.

A Theoretical Study on Post-It-Like Debonding Process for BCB Cap Transfer Packaging Based on FEM Simulation

S. Seok, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Experiment and analysis of the effect of BCB sealing ring flatness on BCB cap transfer packaging

S. Seok, 2020 .

An FEM study of die attach packaging effect on nanomechanical Si optical filters

D. Hah, S. Seok, 2017, 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Thermo-mechanical simulation of BCB membrane thin-film package

N. Rolland, P. Rolland, S. Bouwstra, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

A theoretical and experimental study of the BCB thin-film cap zero-level package based on FEM simulations

N. Rolland, P. Rolland, S. Seok, 2010 .

Polymer-based zero-level packaging technology for high frequency RF applications by wafer bonding/debonding technique using an anti-adhesion layer

N. Rolland, P. Rolland, S. Seok, 2012 .

Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

N. Rolland, P. Rolland, S. Seok, 2012 .

An RF-MEMS based SP4T switched LNA MMIC used in a 24 GHz beam-steering antenna module

M. A. Campo, T. Vaha-Heikkila, M. Fryziel, 2015, 2015 10th European Microwave Integrated Circuits Conference (EuMIC).

Polymer Cap Transfer Packaging Technologies

S. Seok, 2018 .

Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

Jinseok Kim, S. Seok, HyungDal Park, 2022, Micromachines.

Scotch-tape surface wrinkling based thin-film material properties extraction

Jinseok Kim, S. Seok, HyungDal Park, 2022, Journal of Micromechanics and Microengineering.

Low temperature solid–liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films

A. Bosseboeuf, N. Isac, J. Moulin, 2015, 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

S. Seok, 2021, Micromachines.

FEM Modeling of Debonding of Transfer Packaging

S. Seok, 2018 .

A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation

Jinseok Kim, S. Seok, HyungDal Park, 2022, Micromachines.

Wide-band millimetre-wave antenna based on Si and suspended BCB membrane

N. Rolland, L. Dussopt, H. Salti, 2015 .

Seonho Seok, S. Seok, 2018 .

Ultralow-phase-noise oscillators based on BAW resonators

Nathalie Rolland, Vincent Giordano, Seonho Seok, 2014, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control.

Design, realization, and test of a 2.1‐GHz low‐phase‐noise oscillator based on BAW resonator

Nathalie Rolland, Mingdong Li, P.-A. Rolland, 2011 .

Comparison of low phase noise oscillators topologies using BAW resonator

N. Rolland, P. Rolland, P. Vincent, 2010, The 5th European Microwave Integrated Circuits Conference.

Low-temperature zero-level packaging technique using photosesitive film type PerMX polymer

S. Seok, Janggil Kim, N. Rolland, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications

N. Rolland, P. Rolland, S. Seok, 2008 .

A Novel Zero-Level Packaging using BCB Adhesive Bonding and Glass Wet-Etching for Millimeter-Wave Applications

N. Rolland, P. Rolland, S. Seok, 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

Packaging methodology for RF devices using a BCB membrane transfer technique

N. Rolland, S. Seok, P. Rolland, 2006 .

A New BCB Film Zero-Level Packaging for RF Devices

N. Rolland, P. Rolland, S. Seok, 2006, 2006 European Microwave Conference.

Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications

N. Rolland, P. Rolland, S. Seok, 2006 .

Low-Temperature Photosesitive Film-Type Permx Polymer Zero-Level Packaging Technique for RF Applications

N. Rolland, P. Rolland, S. Seok, 2014 .

Wafer level packaging compatible with millimeter-wave antenna

N. Rolland, T. Lasri, S. Seok, 2012 .

Enhancement of bonding strength of packaging based on BCB bonding for RF devices

N. Rolland, P. Rolland, S. Seok, 2012 .