S. Kim

Low temperature epoxy bonding for wafer level MEMS packaging

Yong Kook Kim, B. Ju, Eun-Kyung Kim, 2008 .

Bias-heating recovery of MWCNT gas sensor

Byeong Kwon Ju, B. Ju, Hun-Kuk Park, 2008 .

Carrier-type modulation of tungsten diselenide (WSe2) field-effect transistors (FETs) via benzyl viologen (BV) doping

B. Ju, Seungwon Lee, S. Kim, 2021 .

Ceramic to metal joining by using 1064 nm pulsed and CW laser energy source

Young Min Lee, Joohan Kim, S. Kim, 2013 .

Environment-friendly Trivalent Chromate Treatment for Zn Electroplating

S. Kim, Chul-Tae Lee, 2006 .

Ceramic to metal joining by using 1064 nm pulsed and CW laser energy source

Young Min Lee, Joohan Kim, S. Kim, 2013, Journal of Mechanical Science and Technology.

Ultrathin silicon micropackaging for RF MEMS devices

Yong Kook Kim, B. Ju, Jai Kyeong Kim, 2006 .

Fabrication of suspended thin film resonator for application of RF bandpass filter

Soo Won Kim, Byeong Kwon Ju, Hyun Ho Kim, 2004, Microelectron. Reliab..