Mingliang L. Huang

发表

Complexation Behavior and Co-Electrodeposition Mechanism of Au-Sn Alloy in Highly Stable Non-Cyanide Bath

F. Huang, Mingliang L. Huang, 2018 .

Effect of Cu on interfacial reaction in high-lead solder bumps

B. Lian, Quanbin Yao, Mingliang L. Huang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Effects of oxygen flows on optical properties, micro-structure and residual stress of Ta 2 O 5 films deposited by DIBS

Mingliang L. Huang, Gang Li, Shaoqian Zhang, 2018, Optik.

Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect

Mingliang L. Huang, Leida Chen, Shaoming Zhou, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects

Fan Yang, Mingliang L. Huang, Jiameng Kuang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

Haoran Ma, N. Zhao, Mingliang L. Huang, 2018, Journal of Materials Science: Materials in Electronics.

A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 Based Anisotropic Conductive Films

K. Paik, P. He, Mingliang L. Huang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step electrodeposition

Jinwei Cao, Mingliang L. Huang, Yunpeng Wang, 2020 .

Fabrication of broadband antireflection coatings using wavelength-indirect broadband optical monitoring

Mingliang L. Huang, Gang Li, Q. Lv, 2018 .

Effect of In addition on the properties of Sn-Au-Cu lead-free solder

Mingliang L. Huang, S. Yin, Yu Chen, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows

Haoran Ma, N. Zhao, Mingliang L. Huang, 2017, Journal of Materials Science: Materials in Electronics.

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles

N. Zhao, Mingliang L. Huang, Shengyan Shang, 2018, Journal of Materials Science: Materials in Electronics.

The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Cong-qian Cheng, Jie Zhao, Mingliang L. Huang, 2009 .

A non-invasive permittivity measurement based on split-ring resonators at microwave frequencies

Mingliang L. Huang, Jing Dong, Ping Ren, 2015, 2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies (MAPE).

Effect of [Au]/[Na2SO3] molar ratio on co-electroplating Au-Sn alloys in sulfite-based solution

Mingliang L. Huang, Jianlin Pan, Xiangyong Qing, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Dual-cluster model of Sn-based binary eutectics and solders

Mingliang L. Huang, D. Dong, Chuang Dong, 2022, Materials Today Communications.

Electroless nickel-boron plating on magnesium alloy

Lai Wang, Mingliang L. Huang, N. Fan, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

Mingliang L. Huang, Leida Chen, Shaoming Zhou, 2010 .

Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

J. Zhao, M. Huang, N. Zhao, 2016 .

Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration

Fan Yang, N. Zhao, Mingliang L. Huang, 2015 .

Reverse polarity effect in Cu/Sn-9Zn/Ni interconnect under high current density at high temperature

N. Zhao, Mingliang L. Huang, Zhijie Zhang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Effect of liquid-solid electromigration on interfacial reaction in Cu/Sn-9Zn/Cu solder joint

Mingliang L. Huang, Haitao Ma, Jie Zhao, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Study on liquid-solid electromigration in Cu/Sn-9Zn/Cu interconnect using synchrotron radiation real-time in situ imaging technology

N. Zhao, Mingliang L. Huang, Zhijie Zhang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/Cu interconnect during liquid-solid electromigration

Zhaodong Zhang, N. Zhao, Mingliang L. Huang, 2013 .

Effect of electromigration on interfacial reaction of Cu/Sn3.0Ag0.5Cu/Ni solder joint at high temperature

Mingliang L. Huang, Yuming Ye, Leida Chen, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering

Chi‐Man Lawrence Wu, Xiaoying Liu, Lai Wang, 2010 .

Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder

Mingliang L. Huang, Haitao Ma, Qiang Zhou, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy

Chi‐Man Lawrence Wu, N. Zhao, Mingliang L. Huang, 2016, Journal of Materials Science: Materials in Electronics.

Creep resistance of tin-based lead-free solder alloys

C. L. Wu, Mingliang L. Huang, C.M.L. Wu, 2005 .

Creep behavior of eutectic Sn-Cu lead-free solder alloy

Mingliang L. Huang, C.M.L. Wu, Chi Man Wu, 2002 .

On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

Ning Zhao, Mingliang Huang, Anil Kunwar, 2016 .

Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model

Jing Ren, Mingliang L. Huang, Xudong Yang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Covalent Anchoring of Carbon Nanotube-Based Thermal Interface Materials Using Epoxy-Silane Monolayers

Johan Liu, Yifeng Fu, Mingliang L. Huang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature

Ming Yang, K. Paik, P. He, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

K. Paik, P. He, N. Zhao, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5

L. Qu, N. Zhao, Mingliang L. Huang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions

Cong-qian Cheng, Jie Zhao, Mingliang L. Huang, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Effect of solder volume on interfacial reaction between Sn-3Ag-0.5Cu solder ball and Cu Pad after multiple reflows

Fan Yang, Mingliang L. Huang, Luwei Liu, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and cu pad

Mingliang L. Huang, Luwei Liu, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Shear Failure Analysis of Sub-50 μm Flip Chip Lead-free Solder Bumps

Mingliang L. Huang, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Electromigration-Induced β-Sn Grain Rotation in Lead-Free Flip Chip Solder Bumps

Hongyu Sun, Mingliang L. Huang, J. Kuang, 2019, Electronic Components and Technology Conference.

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

M. Huang, Haoran Ma, N. Zhao, 2017 .

In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient

M. Huang, Haoran Ma, N. Zhao, 2016 .

Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient

N. Zhao, Mingliang L. Huang, Haitao Ma, 2015, International Conference on Electronic Packaging Technology.

In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction

Ning Zhao, Huijing Zhao, Mingliang Huang, 2014 .

Different Diffusion Behavior of Cu and Ni Undergoing Liquid–solid Electromigration

Lidong Chen, Haoran Ma, Mingliang L. Huang, 2014 .

In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

Haoran Ma, L. Qu, N. Zhao, 2014 .

Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder

Chi‐Man Lawrence Wu, C. L. Wu, Mingliang Huang, 2010 .

Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn–3.5Ag/Cu interconnects

M. Huang, N. Zhao, Mingliang L. Huang, 2016 .

On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration

Ning Zhao, Mingliang Huang, Anil Kunwar, 2016, Journal of Materials Science: Materials in Electronics.

Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu Joints

Mingliang L. Huang, Q. Zhou, N. Kang, 2012 .

Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints

Mingliang L. Huang, F. Yang, 2015 .

Comment on “Electric current induced flow of liquid metals: Mechanism and substrate-surface effects” [J. Appl. Phys. 115, 044915 (2014)]

N. Zhao, Mingliang L. Huang, Z. J. Zhang, 2017 .

Au-Sn co-electroplating solution for flip chip-LED bumps

Mingliang L. Huang, Jianlin Pan, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM

Mingliang L. Huang, Yang Wu, S. N. Zhang, 2021 .

The effect of laser-soldering parameters on the Sn-Ag-Cu/Cu interfacial reaction

L. Qu, Mingliang L. Huang, Haitao Ma, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration

N. Zhao, Mingliang L. Huang, Haitao Ma, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process

L. Qu, N. Zhao, Mingliang L. Huang, 2014, Journal of Electronic Materials.

Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn–Ag–Cu solder bumps

N. Zhao, Mingliang L. Huang, F. Yang, 2014 .

Effects of cooling rate and solder volume on the formation of large Ag 3 Sn plates in Sn-Ag based solder joints

N. Zhao, Mingliang L. Huang, Q. Zhou, 2012 .

Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and on polycrystalline Ni

Mingliang L. Huang, Haitao Ma, Huan Liu, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Comparative study of interfacial reactions of High-Sn lead-free solders on single crystal Cu and on polycrystalline Cu

Mingliang L. Huang, Y. Cui, Yipeng Cui, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient

N. Zhao, Mingliang L. Huang, Yunpeng Wang, 2016 .

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

Ning Zhao, N. Zhao, Mingliang L. Huang, 2015 .

Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect

N. Zhao, Mingliang L. Huang, S. Ye, 2011 .

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

N. Zhao, Mingliang L. Huang, Haitao Ma, 2017 .

Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient

N. Zhao, Mingliang L. Huang, Haitao Ma, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

N. Zhao, Mingliang L. Huang, F. Yang, 2015 .

Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects

Fan Yang, N. Zhao, Mingliang L. Huang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding

Luqiao Yin, N. Zhao, Mingliang L. Huang, 2017 .

Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

N. Zhao, Mingliang L. Huang, Haitao Ma, 2016 .

Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package

Ning Zhao, Mingliang Huang, N. Zhao, 2016 .

Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model

C. Dong, Mingliang Huang, Mingliang L. Huang, 2016 .

Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

H. Reichl, A. Ostmann, T. Loeher, 2005 .

Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joints

Mingliang L. Huang, Leida Chen, Xiaoyan Liu, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Microstructure and mechanical properties of Al/Sn-Zn-X/Cu solder joints

Jiaxi Liu, N. Zhao, Mingliang L. Huang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Interfacial reaction and mechanical properties of Al/Sn-Zn-Ni/Cu solder joints

Mingliang L. Huang, Haitao Ma, Yaochun Yang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

N. Zhao, Mingliang L. Huang, Yunpeng Wang, 2017, Journal of Materials Science: Materials in Electronics.

Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

Mingliang L. Huang, Xing-rong Liu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals

Mingliang L. Huang, Yunpeng Wang, Haitao Ma, 2022, Materials Letters.

Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density

Mingliang L. Huang, Shengyan Shang, Yunpeng Wang, 2021 .

Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage

N. Zhao, Mingliang L. Huang, Yunpeng Wang, 2017, Journal of Materials Science: Materials in Electronics.

Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint

N. Zhao, Mingliang L. Huang, Haitao Ma, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows

L. Qu, N. Zhao, Mingliang L. Huang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu interconnect

Mingliang L. Huang, L. D. Chen, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

N. Zhao, Mingliang L. Huang, F. Yang, 2015 .

Effects of bath temperature on co-electroplating Au-Sn alloys for electronic packaging

F. Huang, Mingliang L. Huang, Fang Tang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films

F. Huang, N. Zhao, Mingliang L. Huang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy

Chunyan Lu, F. Huang, Mingliang L. Huang, 2019, International Conference on Electronic Packaging Technology.

Sequential non-cyanide electroplating Au/Sn/Au films for flip chip-led bumps

Mingliang L. Huang, Yang Liu, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Effects of plating parameters on the Au-Sn co-electrodepositon for flip chip-LED bumps

Mingliang L. Huang, Jianlin Pan, S. Pan, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Mingliang L. Huang, M. Huang, Y. Wu, 2020 .

Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applications

F. Huang, Mingliang L. Huang, Yawei Liu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Non-cyanide Electroplating of Gold-Tin Eutectic Alloy for Flip-Chip Packaging of LED

F. Huang, Mingliang L. Huang, Chao Fang, 2021, International Conference on Electronic Packaging Technology.

Dissolution and precipitation of Ag3Sn plates in ultra fine solder joints using synchrotron radiation real-time imaging technology

Fan Yang, N. Zhao, Mingliang L. Huang, 2013, International Conference on Electronic Packaging Technology.

Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects

Hongyu Sun, Mingliang L. Huang, 2017, International Conference on Electronic Packaging Technology.

Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode

C. Dong, Fei Chen, Mingliang L. Huang, 2021 .

Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints

Yingzhuo Huang, Mingliang L. Huang, N. Kang, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration

Mingliang L. Huang, Zhijie Zhang, Leida Chen, 2014 .

A highly stable electroplating bath for micro-scale Sn-Ag solder bumping

F. Huang, Mingliang L. Huang, Yunpeng Wang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration

N. Zhao, Mingliang L. Huang, Haitao Ma, 2016, 2016 China Semiconductor Technology International Conference (CSTIC).

Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls

Mingliang L. Huang, A. Wu, Yan Qiu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Effects of Annealing on Residual Stress in Ta2O5 Films Deposited by Dual Ion Beam Sputtering

Mingliang L. Huang, Yuqi Jin, Gang Li, 2018 .