S. Pan

Experimental characterization of coupling effects between two on-chip neighboring square inductors

Y. Gan, W. Yin, Le-Wei Li, 2003 .

Experimental characterization of on-chip inductor and capacitor interconnect: part II. Shunt case

Y. Gan, W. Yin, L. Li, 2004, IEEE Transactions on Magnetics.

Experimental characterization of on-chip inductor and capacitor interconnect: part I. Series case

Ban-Leong Ooi, Wen-Yan Yin, Yeow-Beng Gan, 2003 .

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

W. Yin, M. Leong, L. Li, 2002 .

Development of a new improved high performance flip chip BGA package

A.Y.S. Sun, H.B. Tan, D.Y.R. Chong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Modelling on-chip circular double-spiral stacked inductors for RFICs

W. Y. Yin, S. J. Pan, L. W. Li, 2003 .

Experimental characterisation of on-chip octagonal double-helix inductors on silicon substrates

S. J. Pan, W. Y. Yin, L.-W. Li, 2003 .

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Y. Gan, W. Yin, F. Lin, 2003 .

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

A.Y.S. Sun, D.Y.R. Chong, B.K. Lim, 2006, IEEE Transactions on Advanced Packaging.