Chia-Ken Leong

发表

Pressure electrical contact improved by carbon black paste

D. Chung, Chia-Ken Leong, D. Chung, 2004 .

Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

D. Chung, Yunsheng Xu, Chia-Ken Leong, 2007 .

Carbon black pastes as coatings for improving thermal gap-filling materials

D. Chung, Chia-Ken Leong, Y. Aoyagi, 2006 .

Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

D. Chung, Chia-Ken Leong, 2003 .

Effect of through-thickness compression on the microstructure of carbon fiber polymer-matrix composites, as studied by electrical resistance measurement

Shoukai Wang, Chia-Ken Leong, D. Chung, 2006 .

Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink

Chia-Ken Leong, D. Chung, Timothy A. Howe, 2006 .

Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black

D.D.L. Chung, Chia-Ken Leong, Chia-Ken Leong, 2006 .

Polyol-based phase-change thermal interface materials

Chia-Ken Leong, Y. Aoyagi, D. Chung, 2006 .

Carbon black dispersions and carbon–silver combinations as thermal pastes that surpass commercial silver and ceramic pastes in providing high thermal contact conductance

D. Chung, Chia-Ken Leong, 2004 .

Factors That Govern the Performance of Thermal Interface Materials

D. Chung, Chia-Ken Leong, Parisa Pour Shahid Saeed Abadi, 2008 .