K. Tan

发表

Bian Xinhai, Guo Hongyan, Zhang Li, 2014, 2014 15th International Conference on Electronic Packaging Technology.

N. Lee, J. Lau, C. Ko, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

N. Lee, J. Lau, J. Lo, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Li Zhang, K. Tan, C. Lai, 2013, 2013 14th International Conference on Electronic Packaging Technology.

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Lei Zhang, Li Zhang, K. Tan, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

C. Ko, R. Beica, J. Lau, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

N. Lee, J. Lau, J. Lo, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

J. Lau, C. Ko, R. Beica, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Li Zhang, K. Tan, C. Lai, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Qiang Zhao, Li Zhang, Wenguo Ning, 2014, 2014 15th International Conference on Electronic Packaging Technology.

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

J. Lau, J. Lo, C. Ko, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

J. Lau, Li Zhang, K. Tan, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

N. Lee, J. Lau, J. Lo, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

N. Lee, Lin Jin, J. Lo, 2018, International Symposium on Microelectronics.

John H. Lau, Ming Li, Cao Xi, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Li Zhang, T. Liakopoulos, K. Tan, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.