B. Lok

发表

Effects of the morphology of inkjet printed zinc oxide (ZnO) on thin film transistor performance and seeded ZnO nanorod growth

Xiao Hu, Y. Liang, B. Lok, 2013 .

Mixed-mode S-parameter characterization of differential structures

L. L. Wai, B. Lok, W. Fan, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Patterned surface with controllable wettability for inkjet printing of flexible printed electronics.

Y. Lam, L. Yeo, B. Lok, 2014, ACS applied materials & interfaces.

Control of Droplet Formation in Inkjet Printing Using Ohnesorge Number Category: Materials and Processes

Y. Liang, B. Lok, J. Tai, 2008, 2008 10th Electronics Packaging Technology Conference.

Reduction of droplet volume by controlling actuating waveforms in inkjet printing for micro-pattern formation

Yee Cheong Lam, Hiong Yap Gan, X. Shan, 2009 .

Low temperature processing for integrated magnetics

L. L. Wai, Kyung W. Paik, B. Lok, 2007, 2007 International Conference on Electronic Materials and Packaging.

Optimizing manufacturing process of printed electronics

B. Salam, L. Albert, B. Lok, 2009, 2009 11th Electronics Packaging Technology Conference.

Washability of Flexible Printed Circuitry for Wearable Electronics Applications

X. Shan, B. Salam, B. Lok, 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

Effect of plasma treated ITO substrate on inkjet printing of conductive ink

B. Lok, P. Ng, X. Hu, 2006, 2006 8th Electronics Packaging Technology Conference.

Spatially selective patterning of zinc oxide precursor solution by inkjet printing

Xiao Hu, Y. Liang, B. Lok, 2009, 2009 11th Electronics Packaging Technology Conference.

Characterization of Inkjet Printed MWCNT in Colloidal and Conductive Polymer Solution

B. Lok, X. Hu, Y.N. Liang, 2008, 2008 10th Electronics Packaging Technology Conference.

Investigation of Ta2O5/SiO2/4H-SiC MIS capacitors

Rusli, Jian H. Zhao, F. K. Lai, 2006 .

Roll-to-Roll Gravure Printing of Electric Heaters on Polymeric Substrates

X. Shan, B. Salam, B. Lok, 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

Selective surface modification of PET substrate for inkjet printing

L. Yeo, Y. C. Lam, B. Lok, 2014, The International Journal of Advanced Manufacturing Technology.

Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Hongyu Y Zheng, B. Lok, J. C. Hernandez-Castaneda, 2020 .

Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Hongyu Y Zheng, B. Lok, J. C. Hernandez-Castaneda, 2019, Frontiers of Mechanical Engineering.

Hydrothermal growth of BaTiO3 thin films on printed circuit boards for integral capacitor applications

D. Chi, G. Goh, B. Lok, 2006 .

Biomolecule-Interactive Flexible Light Emitting Capacitor Display.

X. Qi, Kanyi Pu, R. Wu, 2021, Small.

Performance characterization of flexible printed supercapacitors

Hiong Yap Gan, Boon Keng Lok, B. Lok, 2009, 2009 11th Electronics Packaging Technology Conference.

Encapsulation and packaging of biosensor

B. Lok, W. Fan, B.K. Tan, 2005, 2005 7th Electronic Packaging Technology Conference.

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

Chak-Kuen Wong, John H. L. Pang, J. W. Tew, 2008, Microelectron. Reliab..

Solderability and reliability of printed electronics

B. Salam, B. Lok, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Hybrid analytical modeling method for split power bus in multilayered package

Joungho Kim, Wei Fan, A.C.W. Lu, 2006, IEEE Transactions on Electromagnetic Compatibility.

Selective surface modification of PET substrate for inkjet printing

Yee Cheong Lam, L. Yeo, Y. C. Lam, 2014 .

355 nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates

X. C. Wang, X. Wang, Z. L. Li, 2008 .

Printing Process of Electrically Conductive Silver on Heat Transfer Polymer Substrates for Wearable Electronics Applications

X. Shan, B. Salam, B. Lok, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Control of photoresist film thickness: Iterative feedback tuning approach

Arthur Tay, Weng Khuen Ho, Jiewen Deng, 2006, Comput. Chem. Eng..

Process Integration of Inkjet Printing and Electroless Plating for LTCC Substrates

P. W. Gian, B. Lok, A. Lu, 2007, 2007 9th Electronics Packaging Technology Conference.