Karina Leung
发表
Jingshen Wu,
Yejun Zhu,
Lei Zhang,
2014,
IEEE Transactions on Device and Materials Reliability.
Matthias Petzold,
Robert Klengel,
Karina Leung,
2010,
2010 12th Electronics Packaging Technology Conference.
Ke Xue,
Haibin Chen,
Jiale Han,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.