C.L. Gan

发表

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

U. Hashim, C.L. Gan, 2015, Journal of Materials Science: Materials in Electronics.

Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation

F. Che, H. Ng, C.L. Gan, 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

U. Hashim, C.L. Gan, B. L. Chan, 2014, Gold Bulletin.

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

U. Hashim, C.L. Gan, B. L. Chan, 2014, Journal of Electronic Materials.

Reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds

U. Hashim, C.L. Gan, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

U. Hashim, C.L. Gan, 2014, Journal of Materials Science: Materials in Electronics.

Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors

W. A. Sasangka, Y. Gao, C.L. Gan, 2019, Microelectronics Reliability.

Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

C.L. Gan, H. Uda, 2013, PloS one.

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

U. Hashim, C.L. Gan, 2013, Journal of Materials Science: Materials in Electronics.

Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online)

Chong Leong Gan, Uda Hashim, Classe Francis, 2014, Microelectronics and reliability.

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

C.L. Gan, H. Takiar, Min-Hua Chung, 2021, Journal of Materials Science: Materials in Electronics.

Extended reliability of gold and copper ball bonds in microelectronic packaging

U. Hashim, C.L. Gan, B. L. Chan, 2013, Gold Bulletin.

Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online)

Chong Leong Gan, Uda Hashim, U. Hashim, 2015, Microelectron. Reliab..

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Uda Hashim, C. L. Gan, U. Hashim, 2014 .

Technological sustainable materials and enabling in semiconductor memory industry: A review

C.L. Gan, H. Takiar, Chen-Yu Huang, 2023, e-Prime.

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.

U. Hashim, C.L. Gan, 2013, Journal of electronic packaging.

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

U. Hashim, C.L. Gan, B. L. Chan, 2013, Journal of Nanomaterials.

Prognostics and Health Management of Electronics: Fundamentals, MachineLearning, and the Internet of Things: John Wiley & Sons Ltd. (2018). pp. 731, ISBN: 9781119515326 (Print), 9781119515326 (Online)

Chong Leong Gan, C.L. Gan, 2020 .