Tianyu Yang
发表
P. Braun,
W. King,
B. Kwon,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
P. Braun,
W. King,
B. Kwon,
2018
.
Donald J. Docimo,
A. Alleyne,
N. Miljkovic,
2021,
Physical review. E.
W. King,
N. Miljkovic,
Tianyu Yang,
2021,
Cell Reports Physical Science.
Thomas Foulkes,
Tianyu Yang,
William P. King,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
P. Braun,
W. King,
B. Kwon,
2020
.
K. Haran,
W. King,
N. Miljkovic,
2021,
IEEE Transactions on Industry Applications.
W. King,
N. Miljkovic,
Tianyu Yang,
2023,
International Journal of Heat and Mass Transfer.
Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices
Hyoyoung Jeong,
W. King,
J. A. Rogers,
2023,
Nature Communications.
Skin-integrated systems for power efficient, programmable thermal sensations across large body areas
Yei Hwan Jung,
M. Flavin,
Yonggang Huang,
2023,
Proceedings of the National Academy of Sciences of the United States of America.