H. Clauberg

发表

Flash pyrolysis nozzle for generation of radicals in a supersonic jet expansion

D. Kohn, H. Clauberg, Peter Chen, 1992 .

Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding

H. Clauberg, B. Chylak, Jamin Ling, 2009 .

Wire bonding optimization with fine copper wire for volume production

Kuan Fang Lee, H. Clauberg, B. Chylak, 2010, 2010 12th Electronics Packaging Technology Conference.

Enabling high volume fine pitch copper wire bonding: Enhancements to process and equipment capability

John Foley, H. Clauberg, B. Chylak, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation

V. L. Acoff, H. Clauberg, B. Chylak, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Chip-to-Chip and Chip-to-Wafer Thermocompression Flip Chip Bonding

H. Clauberg, B. Chylak, A. Rezvani, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Dynamics of Rotational Energy Release for Dissociation of Singlet Ketene and the Singlet/Triplet Branching Ratio

C. Moore, Sang Kyu Kim, H. Clauberg, 1997 .

Advances in Memory Die Stacking

Jie Wu, Andreas Marte, Urban Ernst, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

Horst Clauberg, Bob Chylak, Ivy Qin, 2013 .

New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study

V. L. Acoff, H. Clauberg, B. Chylak, 2016 .

Mass and photoelectron spectroscopy of C3H2. .DELTA.Hf of singlet carbenes deviate from additivity by their singlet-triplet gaps

H. Clauberg, Peter Chen, D. Minsek, 1992 .

Photochemical degradation of poly(ethylene terephthalate)-modified copolymer

Agnès Rivaton, J. Gardette, H. Clauberg, 2000 .

Photoionization Mass and Photoelectron Spectroscopy of Radicals, Carbenes, and Biradicals

Joel A. Blush, D. Kohn, H. Clauberg, 1992 .

Photoelectron spectrum of cyclopropenylidene and weak bonds in cyclopropenyl radical

H. Clauberg, Peng Chen, 1991 .

Vibrational Assignment of theS1Fluorescence Excitation Spectrum of Formyl Fluoride

Young S. Choi, J. Stanton, C. Moore, 1997 .

Nickel-palladium bond pads for copper wire bonding

Horst Clauberg, Bob Chylak, Petra Backus, 2011, Microelectron. Reliab..

Copper Wire Bonding: R&D to High Volume Manufacturing

Horst Clauberg, Bob Chylak, John Foley, 2012 .

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

V. L. Acoff, S. Song, H. Clauberg, 2012 .

Stimulated Emission Pumping Spectra and Intramolecular Vibrational Dynamics of DFCO(S0) from 9000 to 20 000 cm -1

C. Moore, J. Crane, H. Clauberg, 1998 .

High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications

H. Clauberg, B. Chylak, O. Yauw, 2016, Electronic Packaging Technology Conference.

Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding

Michael Mayer, Horst Clauberg, Alireza Rezvani, 2017, Microelectron. Reliab..

Thermocompression flip chip bonding optimization for pre-applied underfill

H. Clauberg, B. Chylak, O. Yauw, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Wire bonding with Pd-coated copper wire

Horst Clauberg, Bob Chylak, Nelson Wong, 2010, 2010 IEEE CPMT Symposium Japan.