A. Lesniewska

发表

M. H. van der Veen, V. V. Gonzalez, C. Adelmann, 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

M. H. van der Veen, J. Bekaert, K. Croes, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

K. Croes, O. Pedreira, Z. Tokei, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Z. Tokei, Souvik Kundu, Q. Le, 2022, 2022 IEEE International Interconnect Technology Conference (IITC).

K. Croes, C.J. Wilson, M. Stucchi, 2018, 2018 IEEE International Electron Devices Meeting (IEDM).

Z. Tokei, I. Ciofi, N. Jordán, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

M. H. van der Veen, K. Croes, N. Jourdan, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

K. Croes, S. Demuynck, Marleen H. van der Veen, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Christopher J. Wilson, Kris Croes, Alicja Lesniewska, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

J. De Coster, S. Balakrishnan, K. Croes, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

T. Conard, S. De Gendt, P. Carolan, 2023, ACS applied materials & interfaces.

K. Croes, Z. Tokei, S. Yadav, 2022, Journal of Applied Physics.

K. Croes, S. Demuynck, C. Wu, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

H. Mertens, Z. Tao, K. Devriendt, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).

D. Tsvetanova, O. Pedreira, Z. Tokei, 2022, 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

K. Rebibis, E. Beyne, V. Simons, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).