L. Wen

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

M. H. van der Veen, V. V. Gonzalez, C. Adelmann, 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

Growth evolution and characterization of ultra-thin CoGe2 films synthesized via a catalytic solid–vapour reaction technique

K. Opsomer, C. Adelmann, M. Schaekers, 2014 .

Integration of porous low-k dielectrics using post porosity pore protection

Christopher J. Wilson, N. Heylen, Liping Zhang, 2016 .

Low temperature chemical vapour synthesis of Cu3Ge thin films for interconnect applications

O. Richard, H. Bender, K. Opsomer, 2014 .

Ruthenium metallization for advanced interconnects

Christopher J. Wilson, Christoph Adelmann, Nancy Heylen, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.

Christopher J. Wilson, Philippe Roussel, Christoph Adelmann, 2016, ACS applied materials & interfaces.

Direct etched Cu characterization for advanced interconnects

K. Croes, F. Lazzarino, J. Bommels, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).