A. Pacco
发表
Q. Le,
G. Murdoch,
F. Holsteyns,
2019,
Microelectronic Engineering.
D. Tsvetanova,
T. Ivanov,
B. Govoreanu,
2021
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T. Ivanov,
B. Govoreanu,
I. Radu,
2020,
Physical Review Applied.
M. Lebedev,
W. Calvet,
T. Mayer,
2019,
Chemical communications.
K. Wostyn,
Xiumei Xu,
S. Gendt,
2014
.
K. Wostyn,
S. Gendt,
S. Brems,
2014
.
H. Philipsen,
F. Holsteyns,
A. Pacco,
2019,
Nanoscale Research Letters.
G. Beyer,
Z. Tokei,
P. Mertens,
2009,
2009 IEEE International Interconnect Technology Conference.
N. Collaert,
R. Loo,
M. Caymax,
2018,
Nanoscale.
S. Laurent,
L. Vander Elst,
R. Muller,
2005,
Chemistry.
H. Struyf,
S. Gendt,
P. Mertens,
2012
.
U. Mirsaidov,
F. Holsteyns,
A. Pacco,
2018,
Solid State Phenomena.
A. Veloso,
F. Sebaai,
H. Struyf,
2011
.
U. Mirsaidov,
F. Holsteyns,
A. Pacco,
2022,
ACS Applied Electronic Materials.
B. Govoreanu,
I. Radu,
J. Swerts,
2022,
2211.16437.
K. Binnemans,
T. Parac‐Vogt,
A. Pacco,
2008
.
K. Binnemans,
K. Pierloot,
T. Parac‐Vogt,
2005
.
K. Binnemans,
T. Parac‐Vogt,
A. Pacco,
2005,
Journal of inorganic biochemistry.
K. Binnemans,
T. Parac‐Vogt,
P. Nockemann,
2006
.
Refinement of the crystal structure of dichloro-bis(pyridine-N)- copper(II), C10H10Cl2CuN2, at 100 K
K. Binnemans,
L. Van Meervelt,
A. Pacco,
2003
.
A. Pacco,
L. Meervelt,
K. Binnemansn,
2003
.
Q. Le,
A. Pacco,
Yuya Akanishi,
2021,
Solid State Phenomena.
B. Govoreanu,
I. Radu,
J. Swerts,
2022,
2211.16437.
Replacement Metal Contact Using Sacrificial ILD0 for Wrap Around Contact in Scaled FinFET Technology
S. Chew,
K. Devriendt,
S. Demuynck,
2018,
2018 IEEE International Interconnect Technology Conference (IITC).
U. Mirsaidov,
F. Holsteyns,
A. Pacco,
2019,
ACS applied materials & interfaces.
A. Hikavyy,
R. Loo,
M. Caymax,
2009
.
H. Struyf,
S. Gendt,
P. Mertens,
2013
.
Tae Gon Kim,
K. Wostyn,
M. Heyns,
2012
.
A. Pacco,
A. Iwasaki,
E. Sanchez,
2023,
Journal of Vacuum Science & Technology A.
H. Philipsen,
U. Mirsaidov,
H. Huynh,
2023,
Solid State Phenomena.
H. Philipsen,
U. Mirsaidov,
F. Holsteyns,
2023,
Solid State Phenomena.
A. Pacco,
A. Iwasaki,
E. Sanchez,
2021,
2021 IEEE International Interconnect Technology Conference (IITC).
H. Mertens,
K. Devriendt,
J. Geypen,
2021,
2021 IEEE International Electron Devices Meeting (IEDM).
N. Horiguchi,
N. Jourdan,
N. Heylen,
2022,
International Interconnect Technology Conference.